Collateral Management Technology Vendors in 2016: A Finadium Survey
Finadium has conducted its fourth industry-wide survey of collateral management technology vendors, providing a comparative look at the development of this sector. The survey provides readers with a product summary, product coverage, market differentiators, new functionalities added in the last year and technology and implementation considerations. On an industry-wide basis, we analyze the important new features that vendors are adding, what problems their clients are trying to solve and what parts of the client organization that vendors are supporting.
As the collateral management market matures, vendors are converging towards common goals while working to maintain their distinctions and selling points. This provides buyers with a strong array of options for partnering with vendors; it also complicates the decision making process by making it more difficult to understand how vendors differ and which should be purchased based on their individual strengths.
The 19 vendors in our survey range from major names to start-ups that have begun to gain traction. We saw some firms leave our survey pool since our first survey as their market focus has shifted, suggesting that control of collateral management technology is consolidating towards a narrower set of vendors than in the past. We also see the evolution of firms with niche specialties that support their sales alongside more established products and services.
The results of this survey are useful to financial market professionals in the front office, operations and technology working to evaluate the vendor landscape. It may also be useful to investors in financial technology and to the vendors themselves in assessing their competitive positioning.
This report is 59 pages with 4 exhibits.
TABLE OF CONTENTS
■ Executive Summary
■ The State of Collateral Technology
■ Industry Analysis
– Recent and Upcoming Features
– What Problems Are Clients Trying to Solve?
– Scope of Support at Client Organizations
■ Vendor Submissions
– The Vendors
■ About the Authors
■ About Finadium