July 2021

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Finadium has conducted its seventh industry-wide survey of collateral management technology vendors, providing a comparative look at the development of this sector, and focusing exclusively on vendors providing technology to a bank or buy-side user as a dedicated service.

The 22 vendors and 37 products in this year’s collateral technology survey demonstrate important divergences in product development and the direction of underlying clients. While there are common themes of automation, risk reduction and collateral optimization, a more detailed look shows new paths in recently added and upcoming features. This is important information for the future of both the collateral technology space and what clients are able to accomplish using vendor solutions.

The survey provides readers with a product summary and coverage, market differentiators, new functionalities added in the last year, and upcoming development plans. On an industry-wide basis, we analyze the important new features that vendors are adding, what problems their clients are trying to solve and how vendors are applying technologies from outside financial services.

The results of this survey are useful to financial market professionals in front office, operations and technology, who are working to evaluate the vendor landscape. They may also be useful to investors in financial technology and to the vendors themselves in assessing their competitive positioning.

Table of Contents

  • Executive Summary
  • Improving Market Efficiency Through Technology
    • – Methodology
  • Industry Analysis
    • – Recent and Upcoming Features
    • – Adoption of New Technology
  • Vendor Submissions
  • About the Author
  • About Finadium LLC

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